Server Encapsulation & Thermal Management Solution
Mainly used in IC potting, vehicle electronics, server, communication, power supply, high power module and CPU/GPU etc.
High thermal conductivity, low thermal resistance, excellent stability thermal grease, it is the priority product of server, electronics, chips and IGBT etc. In thermal management area.
Performance：
- High thermal conductivity, Low thermal resistance
- Low Bleeding
- No need for curing
- Relatively easy to form lower interface thickness (BLT)
- Can be manually sizing, machine sizing, and printed with wire mesh or steel mesh